SECOR GROUP
Resilience.
This is in our DNA.
The SECOR GROUP sets the standard for resilience in automotive electronics.
For investors and partners who want to shape the transition to the software-defined vehicle without supply chain and integration risks: SECOR identifies risks in the semiconductor supply chain and structurally eliminates them within the vehicle architecture. This is demonstrated by eight patent applications and drivable proof-of-concepts.
Two Companies, One Standard
Design for Resilience.
Structurally eliminates risks in the vehicle’s electrical/electronic architecture.
Service for Resilience.
Identifies risks in the semiconductor supply chain.
Why Now?
Vehicle electronics are being redesigned. New architectures are creating new market opportunities.
With the zonal E/E architecture of the Software-Defined Vehicle, manufacturers will be redesigning their electronics in the coming years for vehicle generations that will remain in service for over a decade. Initiatives such as Eclipse S-CORE are standardizing the middleware. To date, there has been no open standard for both hardware and software.
$519 billion
Global Market for Automotive Software and Electronics in 2035
Source: McKinsey, January 2026; global forecast
>3×
Market for zonal and central control units: more than a threefold increase from 2030 to 2035
Source: McKinsey, January 2026; global forecast
about 16%
Annual Growth in Automotive Operating Systems and Middleware
CAGR 2025–2035 · Source: McKinsey, January 2026; worldwide
150 → 10
Control units per vehicle: up to 150 today, less than 10 with SECOR
Company Information · Source: SECOR Chips & Library GmbH
Market data: McKinsey Center for Future Mobility, “The Automotive Software and Electronics Market Through 2035,” January 6, 2026. Global forecasts for passenger cars and light commercial vehicles (“Current Trajectory” scenario). $519 billion: Total market in 2035. Approximately 16% CAGR: Operating systems and middleware, 2025–2035. More than a threefold increase: zonal and central control units, 2030–2035. The individual figures are components of the total market. The market data do not represent revenue forecasts for SECOR. Read the study →
Time Slot
Architectural decisions regarding the electronics for the next generation of vehicles are being made now.
Intellectual Property Rights
Eight patents have been filed: six for SECOR Chips & Library GmbH and two for SECOR Supply Chain Transparency GmbH.
Multiple Sources of Revenue
Licensed hardware, B2B App Store, and consumer App Store (B2C).
Transferable
Standardized electronics are in demand wherever systems need to operate for long periods and require a reliable power supply.
The Approach
A standard.
From hardware to software.
SECOR views the software-defined vehicle as an ecosystem, not as the sum of individual control units. Hardware and software are standardized and developed together from day one. Microcontrollers are interchangeable, software modules are reusable across vehicle generations, and interfaces are open.
Proof of concept
Not on paper. On the street.
The SECOR SDV PoC 2.0 is a mobile vehicle featuring a fully implemented SECOR SDV ECOSYSTEM. It was showcased live for the first time at the 2026 Automotive Electronics Congress.
01 · Hardware
Time Slot
Chiplet-based microcontrollers instead of monolithic chips, pin- and function-compatible from multiple sources.
02 · Software
Modular Software
A library designed for certification, featuring cross-generation modules, standardized APIs, and compatibility with Eclipse SDV.
03 · Supply Chain
Transparent Supply Chain
Assess semiconductor risks before they cause a shutdown. The data is provided by SECOR Supply Chain Transparency GmbH.
Why Now?
What the SECOR SDV ECOSYSTEM Does.
30 %
lower development and production costs
50 %
shorter time to market
through standardized modules and integration starting with the first sprint
3 fabs
resilient supply chain
MCU designed for parallel production across three fabs on different continents
Source: SECOR, technical article in AUTOMOBIL ELEKTRONIK 03/2026 (30% and 50% with reference to AEL 05/2025)
What Has Changed Compared to the State of the Art
| Kriterium | Stand der Technik | SECOR SDV ECOSYSTEM |
|---|---|---|
| Steuergeräte je Fahrzeug | 100–150 | unter 10 |
| Länge des Kabelbaums | 7–10 km | ca. 4 km |
| Austauschbare Mikrocontroller | nein | ja |
| Updates für Hardware und Software | begrenzt | ausgelegt für über 20 Jahre |
| Software-Bibliothek | je Fahrzeug neu | generationsübergreifend |
Source: SECOR Chips & Library, System Comparison: E/E Architecture
Open to partners. Secure at its core.
Open
Standardized APIs based on the COVESA Vehicle Signal Specification (VSS). Non-proprietary software, open source, and compatible with Eclipse SDV.
Protected
The SECOR SDV Concept, the Message Broker, and the plug-and-play principle of the components are patent-pending.
Commercial
SECOR licenses hardware to select Tier 1 suppliers (in the EU, South Korea, and Japan) and operates a B2B app store within the OEM factory as well as a consumer app store (B2C).
Development Status
From proof of concept to mass production.
What’s on the road today, what’s been confirmed by outside sources, and what’s coming next.
Schedule
From a drivable proof of concept to mass production by 2029.
As of November 2026
2025–26
Achieved
Concept, LAB, PoC 2.0
IAA Mobility 2025 · embedded world 2026 · Automotive Electronics Congress 2026
09/2027
In development
SECOR.inside SDV@IAA27
Resilient thanks to two RISC-V processors: Microchip PIC64 and Infineon AURIX RC1.
09/2029
Planned
SECOR.inside SDV@IAA29
Resilient thanks to two RISC-V processors (Microchip PIC64 and Infineon AURIX RC1) and an FPGA, moving toward chiplets.
Financing
The current funding round will take the platform from PoC 2.0 to small-scale production (IAA 2027).
SECOR SDV PoC 2.0
A roadworthy vehicle with a fully implemented SECOR SDV ECOSYSTEM and 100% Fast Ethernet. Live at the Automotive Electronics Congress, June 2026.
SECOR SDV LAB
Unified development setup consisting of one central control unit and two zonal control units. Integration testing and OTA updates every 14 days. World premiere at embedded world in March 2026.
Fraunhofer IIS
Development partner for the RISC-V-based SECOR MCU.
Industry Partners
SECOR is already working with a handful of companies to implement the next generation of PoCs. [Names or industries to be disclosed upon approval]
8 patent applications
6 for SECOR Chips & Library, 2 for SECOR Supply Chain Transparency.
Management
Automotive experience—
, a company that knows the standard.
Dr. Hartwig Schwerdtle
- Over 25 years of OEM management at Audi, BMW, and Mercedes-Benz
- Focus on Supply Chain Expertise, including the VDA Semiconductor Bottleneck Committee
- 5 years as a top-level automotive project manager at Kearney
- Business Angel
Klaus Jungbauer
- Over 30 years of professional IT experience
- Independent project manager for SAP performance enhancement
- Independent expert for databases/architecture
- Programming
Advisory Board
Advice from people
who have shaped the industry.
Partner Emeritus, Kearney, Automotive & Operations
Partner Emeritus at Kearney, former Global Head of Automotive
Formerly at BMW, Production and Supply Chain Strategy
Executive Board Member, Westernacher Group
Co-CEO of dbeyond ag, former board member of MHP
The Companies
Two companies. One goal:
—the resilient vehicle.
SECOR Supply Chain Transparency GmbH identifies risks in the semiconductor supply chain. SECOR Chips & Library GmbH systematically eliminates these risks in the E/E vehicle architecture.
Hardware · Software
SECOR Chips & Library GmbH
Design for Resilience.
SECOR Chips & Library standardizes the architecture of the software-defined vehicle, from the chiplet MCU to OTA updates. Hardware and software are developed in tandem, integrated starting with the first sprint, and remain updatable throughout the vehicle’s entire lifecycle.
SECOR SDV LAB
Development board with integration testing every 14 days
SECOR Chiplets
Modular MCU architecture instead of monolithic SoCs
SECOR Data Usage
Vehicle Data for OTA Updates and Digital Services
SaaS · Supply Chain
SECOR Supply Chain Transparency GmbH
Service for Resilience.
SECOR Supply Chain Transparency makes it possible to quantify risks in the semiconductor supply chain, from sourcing to crisis management. Supplier quotes can be compared based on standardized criteria, and bottlenecks can be identified early on.
SECOR RESILIENCE Score
Compares supplier quotes based on standardized criteria
SECOR Database
Shared Database on the Semiconductor Supply Chain
SECOR Exchange
Antitrust-Compliant Capacity Allocation to Address Supply Bottlenecks
INVESTOR MEETING
Help shape the standard.
As we prepare for our next phase of growth, we are speaking with investors who want to actively support the transition to the software-defined vehicle. Please contact us. A member of our executive team will get back to you personally.
Partners, OEMs, and Tier 1 suppliers are also welcome.
SECOR GROUP GmbH